Features
-Compared to general bisphenol A and bisphenol F epoxy resins, LEP series products have the characteristics of high epoxy value, high purity, and high heat resistance.
-Low viscosity, easy to operate.
-Low halogen content and electrical properties, suitable for use in the electronics industry
-Good water resistance and storage stability.

Recommended application
-Aviation grade composite materials
-Epoxy adhesive used in the electronics industry
-Resin used as conductive adhesive and semiconductor packaging material
-The curing and toughening properties are the same as those of ordinary bisphenol F epoxy resin.